Submission & Publication

Submission

All submitted papers will be reviewed for merit and content. Accepted and presented papers will be published in the Conference Proceedings and submitted to the IEEE Explore Digital Library.

Submit a full manuscript (More than 4 pages and no longer than 8-10 pages) including authors’ names, affiliations and complete email addresses. All papers should be submitted electronically in PDF or Word according to the CFP through our website, using IEEE A4 Style (templates are available from here).

Paper templates can also be downloaded here.

Submission link: https://www.softconf.com/g/phm2017.

All submitted papers will be reviewed for merit and content. Accepted and presented papers will be published in the Conference Proceedings and submitted to the IEEE Explore Digital Library.

 

Publication

Outstanding papers (Extention) will be considered for publication in special issues of international journals, PHM 2017 – Harbin will collaborate with the international journals as below (update dynamically, more potential international journals will release later).

o   Microelectronics Reliability

o   Journal of Risk and Reliability

o   Advances in Mechanical Engineering

o   Energies

o   Journal of Intelligent & Fuzzy Systems

PHM 2017 – Harbin will also cooperate with Chinese Journals, as more and more scholars are paying more attentions to many high quality Chinese journals. Invited authors are encouraged to submit their extended papers to a series of Chinese Journals (submitted in Chinese).

o   YIQI YIBIAO XUEBAO (Chinese Journal of Scientific Instrument,仪器仪表学报), One of the top Chinese Journals in China which is indexed by EI, and the submission link is :http://yqyb.etmchina.com/yqyb/

o   Journal of Electronic Measurement and Instrumentation (电子测量与仪器学报), One of the top Chinese core journals, and the submission link is :http://jemi.etmchina.com/jemi/

Organizers and sponsors for the conferences: